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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE USING IT
Document Type and Number:
Japanese Patent JP2001176927
Kind Code:
A
Abstract:

To provide a highly reliable semiconductor device which has high manufacturing yield and an electronic device wherein it is used by restraining excess interface reaction when a chip part, especially an IC chip substrate, is fixed to a mounting member consisting of a resin material by means of a brazing material bump, and preventing breakage of a brazing part caused by thermal and mechanical change during manufacturing or operation.

In a semiconductor device, a semiconductor substrate is fixed on a mounting member consisting of a resin material provided with a conductor wiring in a surface by a bump which is constituted of a brazing material comprising Sn, or a brazing material comprising two or more kinds of substances selected from a group of Sn, Sb, Ag, Cu, Ni, P, Bi, Zn, Au and In. The semiconductor substrate, the bump and the mounting member are molded from thermosetting resin.


Inventors:
KURIHARA YASUTOSHI
OGAWA TOSHIO
Application Number:
JP36036099A
Publication Date:
June 29, 2001
Filing Date:
December 20, 1999
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
B23K35/26; H01L21/60; H01L23/29; H01L23/31; (IPC1-7): H01L21/60; H01L23/29
Attorney, Agent or Firm:
Sakuta Yasuo