Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP6511695
Kind Code:
B2
Inventors:
Mamoru Yamagami
Application Number:
JP2015008613A
Publication Date:
May 15, 2019
Filing Date:
January 20, 2015
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L23/12; H01L21/56; H01L23/28; H01L23/29
Domestic Patent References:
| JP2009194322A | ||||
| JP2005317832A | ||||
| JP2014086598A | ||||
| JP2011187551A | ||||
| JP2013145820A |
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki
Kyoumura Junji
Mio Kawasaki
Kyoumura Junji