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Title:
SEMICONDUCTOR DEVICE LEAD FRAME
Document Type and Number:
Japanese Patent JPH0661392
Kind Code:
A
Abstract:

PURPOSE: To prevent the rear side of an element mount exposed to the outside from discoloring at assembly.

CONSTITUTION: A Ni plating film 15 is provided at least to an element mounting pad 6, a wire bonding part, and a rear side 10 of the element mounting pad 6 of a transistor lead frame. Furthermore, an Ni-P alloy plating film 16 is provided to a part where the glazing Ni plating film 15 is provided excluding the rear side 10 of the element mounting pad 6 to form a two-layered plating film. By this setup, only the glazing Ni plating film 15 is provided to the rear side 10 of the element mounting pad exposed to the outside after assembly, and the Ni-P alloy plating film 16 is not provided.


Inventors:
CHINDA SATOSHI
FUJIWARA KENICHI
Application Number:
JP1992000208246
Publication Date:
March 04, 1994
Filing Date:
August 04, 1992
Export Citation:
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Assignee:
HITACHI CABLE
International Classes:
H01L23/48; (IPC1-7): H01L23/48
Attorney, Agent or Firm:
松本 孝



 
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