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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2019079967
Kind Code:
A
Abstract:
To provide a semiconductor device and a manufacturing method thereof that can increase reliability by preventing insulation failure due to peeling of a sealing resin on a conductive plate.SOLUTION: A semiconductor device includes a conductive plate 2 on which a semiconductor element 1 is mounted on the front surface and a sealing resin 9 that seals at least the front surface of the conductive plate 2. The conductive plate 2 is provided with a structure 10 that traps air bubbles in a region in which the flows of the encapsulated sealing resin 9 merge. The conductive plate 2 has a rectangular shape, and the sealing resin 9 is injected from one injection port on the long side of the conductive plate 2, and the area in which the flows of the sealing resin 9 merge is an area of the long side corner on the opposite side separating the semiconductor element 1 from the side into which sealing resin 9 is injected.SELECTED DRAWING: Figure 2

Inventors:
INABA YUKI
SATO DAIKI
Application Number:
JP2017206689A
Publication Date:
May 23, 2019
Filing Date:
October 25, 2017
Export Citation:
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Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L23/28; H01L21/56; H01L23/12; H01L23/13; H01L25/07; H01L25/18
Domestic Patent References:
JP2003077946A2003-03-14
JP2015041676A2015-03-02
Foreign References:
US6519844B12003-02-18
US6693239B22004-02-17
Attorney, Agent or Firm:
酒井 昭徳