Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2022078279
Kind Code:
A
Abstract:
To provide a semiconductor device that suppresses leakage of electromagnetic noise to the outside and the influence of electromagnetic noise from the outside and reduces warpage of a semiconductor substrate.SOLUTION: A semiconductor device includes a lower insulating layer 15 formed on the surface of 1 of a semiconductor substrate 10, a wiring portion 21 formed on the lower insulating layer and having the first film thickness, and a shield portion 20 having a second film thickness thinner than the first film thickness and being close to at least two sides of the wiring portion at a predetermined distance on the lower insulating layer.SELECTED DRAWING: Figure 2A
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Inventors:
SHINDO MASANORI
Application Number:
JP2022038899A
Publication Date:
May 24, 2022
Filing Date:
March 14, 2022
Export Citation:
Assignee:
LAPIS SEMICONDUCTOR CO LTD
International Classes:
H01L21/3205
Attorney, Agent or Firm:
Fujihiko Motohiko