Title:
SEMICONDUCTOR DEVICE RESIN SEALING MOLD AND RESIN SEALING METHOD
Document Type and Number:
Japanese Patent JPH0582572
Kind Code:
A
Abstract:
PURPOSE: To enable a semiconductor device of ultra-thin type package to be released from a molding die without causing any damage to its resin outer casing.
CONSTITUTION: A sub-heater 7 which is used for local heating is buried in a molding die adjacent to the surface of a cavity independent of a heater 5 which is used for continuous heating, and the sub-heater 7 is turned ON or OFF synchronously with closing or opening the molding dies to keep the surface of cavity uniform in temperature by heating. By this setup, the setting of the resin outer casing 3 in contact with the surface of cavity and the exudation of a releasing agent are rendered uniform.
Inventors:
NODA TOSHIO
Application Number:
JP23852591A
Publication Date:
April 02, 1993
Filing Date:
September 19, 1991
Export Citation:
Assignee:
NEC CORP
International Classes:
B29B13/02; B29C45/26; B29C45/73; H01L21/56; B29L31/34; (IPC1-7): B29B13/02; B29C45/26; B29C45/73; B29L31/34; H01L21/56
Attorney, Agent or Firm:
Uchihara Shin
Next Patent: RESIN SEALED TYPE SEMICONDUCTOR DEVICE MOLD