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Title:
半導体装置
Document Type and Number:
Japanese Patent JP4019989
Kind Code:
B2
Inventors:
Tadayoshi Okura
Application Number:
JP2003085504A
Publication Date:
December 12, 2007
Filing Date:
March 26, 2003
Export Citation:
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Assignee:
株式会社デンソー
International Classes:
H01L23/28; H01L25/07; H01L25/18; H01L29/78
Domestic Patent References:
JP2002026251A
JP7029873U
Attorney, Agent or Firm:
Masanori Sugawara



 
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