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Patent Searching and Data


Title:
Semiconductor examination jig
Document Type and Number:
Japanese Patent JP6127826
Kind Code:
B2
Inventors:
岡田 章
山下 欽也
秋山 肇
野口 貴也
Application Number:
JP2013164344A
Publication Date:
May 17, 2017
Filing Date:
August 07, 2013
Export Citation:
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Assignee:
三菱電機株式会社
International Classes:
G01R31/26; H01L21/336; H01L21/66; H01L29/78
Domestic Patent References:
JP2013053898A
JP59164256U
JP2001085128A
Attorney, Agent or Firm:
高田 守
高橋 英樹
久野 淑己