Semiconductor examination jig - Mitsubishi Electric Corporation

Title:

Semiconductor examination jig

Document Type and Number:

Japanese Patent JP6127826

Kind Code:

B2

Inventors:

Akira Okada
Kinya Yamashita
Hajime Akiyama
Takaya Noguchi

Application Number:

JP2013164344A

Publication Date:

May 17, 2017

Filing Date:

August 07, 2013

Export Citation:

Assignee:

Mitsubishi Electric Corporation

International Classes:

G01R31/26; H01L21/336; H01L21/66; H01L29/78

Domestic Patent References:

Attorney, Agent or Firm:

Mamoru Takada
Hideki Takahashi
Yoshimi Kuno

Previous Patent: An accumulating electricity device charging and discharging control device of construction machinery

Next Patent: OPERATION CONTROL DEVICE FOR AUTOMATIC WINDER