Title:
半導体発光装置
Document Type and Number:
Japanese Patent JP6964421
Kind Code:
B2
Abstract:
A semiconductor light emitting device includes a substrate made of resin, a first wiring and a second wiring formed on the substrate, a light emitting element disposed on the substrate and electrically connected to the first wiring and the second wiring, and a transparent sealing resin configured to seal the light emitting element. The substrate contains an acrylic resin, and the sealing resin contains silicone.
Inventors:
Obuchi Honor
Junichi Itai
Junichi Itai
Application Number:
JP2017058285A
Publication Date:
November 10, 2021
Filing Date:
March 23, 2017
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L33/62; H01L23/12; H01L23/14; H01L23/29; H01L23/31; H01L33/56
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Foreign References:
| US20170040306 |
Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office