Title:
半導体発光装置
Document Type and Number:
Japanese Patent JP6964421
Kind Code:
B2
Abstract:
A semiconductor light emitting device includes a substrate made of resin, a first wiring and a second wiring formed on the substrate, a light emitting element disposed on the substrate and electrically connected to the first wiring and the second wiring, and a transparent sealing resin configured to seal the light emitting element. The substrate contains an acrylic resin, and the sealing resin contains silicone.
Inventors:
Obuchi Honor
Junichi Itai
Junichi Itai
Application Number:
JP2017058285A
Publication Date:
November 10, 2021
Filing Date:
March 23, 2017
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L33/62; H01L23/12; H01L23/14; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
JP2013201031A | ||||
JP2009130195A | ||||
JP2005209763A | ||||
JP11326718A | ||||
JP2004517175A | ||||
JP2002293801A | ||||
JP2002075458A | ||||
JP2005206704A | ||||
JP2015142012A | ||||
JP2016155355A | ||||
JP2012186450A | ||||
JP201182285A | ||||
JP201369731A | ||||
JP2014216642A | ||||
JP2010267910A | ||||
JP201080640A | ||||
JP2008288487A | ||||
JP2002368277A | ||||
JP2005197479A | ||||
JP200323183A |
Foreign References:
US20170040306 |
Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office