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Title:
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2019220560
Kind Code:
A
Abstract:
To provide a semiconductor manufacturing apparatus capable of reducing uneven supply of fluid between regions on a substrate and a semiconductor device manufacturing method.SOLUTION: In an embodiment, a semiconductor manufacturing apparatus includes a substrate holding unit that holds a plurality of substrates such that the substrates are arranged in parallel with each other. The apparatus may further include a fluid ejection unit that has a plurality of openings for ejecting a fluid to a region in which a distance from a surface of the substrate is within a center-to-center distance between the adjacent substrates, and the fluid ejection unit includes a plurality of openings and that varies the ejection direction of the fluid ejected from the opening by self-excited oscillation in a plane parallel to the surface of the substrate.SELECTED DRAWING: Figure 3

Inventors:
SUGITA TOMOHIKO
SATO KATSUHIRO
ASHIDATE HIROAKI
Application Number:
JP2018116357A
Publication Date:
December 26, 2019
Filing Date:
June 19, 2018
Export Citation:
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Assignee:
KIOXIA CORP
International Classes:
H01L21/306; B05B1/08; B05B1/14; F15C1/22; H01L21/304
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Takeshi Sekine
Akaoka Akira
Jie Yamanoi