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Patent Searching and Data


Title:
SEMICONDUCTOR PACKAGE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP2000294667
Kind Code:
A
Abstract:

To provide a semiconductor package of metal wall type which can be manufactured with a high efficiency and at reduced costs.

A metal frame 20 having notches 21 is brazed on the top of a metal substrate 10 and ceramic terminals 30 for conduction between the inside and the outside of the metal frame 20 are brazed in the notches 21 for forming a semicondctor package. In this case, each of the ceramic terminals 30 comprises a lower ceramic member 31 and an upper ceramic member 32 which is integrally sintered on the lower ceramic member 31, a metallized layer 42 for conduction is formed on the top of the lower ceramic member. A metallized layer 43 for brazing the metal frame is formed on the top of the upper ceramic member 32, grooves 33 are formed on the sides of the ceramic terminal 30, and metallized layers 44 are formed in the grooves 33.


Inventors:
YAMASHITA HIROTO
Application Number:
JP10228399A
Publication Date:
October 20, 2000
Filing Date:
April 09, 1999
Export Citation:
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Assignee:
MATSUSHITA ELECTRONICS CORP
International Classes:
H01L23/02; C04B41/88; H01L23/04; H01L23/06; (IPC1-7): H01L23/02; C04B41/88; H01L23/04; H01L23/06
Attorney, Agent or Firm:
岩橋 文雄 (外2名)