To provide a semiconductor wafer polishing device which can uniformize load a semiconductor wafer to be polished over the entire surface of the wafer, and in addition can smoothly rotate the wafer for polishing.

A semiconductor polishing device is provided with a surface table having a polishing surface, a chuck plate 2 which fixes a semiconductor wafer 1, and a rotationally drive section which rotationally drives the chuck plate 2 with respect to the turntable. In order to universally drive the chuck plate 2 with respect to the surface table, grooves for holding steel balls 3 are respectively formed on a drive ring 5 and a driven ring 8. Between the connecting section between the chuck plate 2 and rotationally drive section and the chuck plate 2, a sealed space section 14 is provided in such a way that by supplying compressed air, nitrogen gas, or water to the section 14, the semiconductor wafer 1 fixed on the chuck plate 2 is uniformly loaded over the surface as a whole.