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Patent Searching and Data


Title:
SEMICONDUCTOR POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2000299301
Kind Code:
A
Abstract:

To provide a semiconductor wafer polishing device which can uniformize load a semiconductor wafer to be polished over the entire surface of the wafer, and in addition can smoothly rotate the wafer for polishing.

A semiconductor polishing device is provided with a surface table having a polishing surface, a chuck plate 2 which fixes a semiconductor wafer 1, and a rotationally drive section which rotationally drives the chuck plate 2 with respect to the turntable. In order to universally drive the chuck plate 2 with respect to the surface table, grooves for holding steel balls 3 are respectively formed on a drive ring 5 and a driven ring 8. Between the connecting section between the chuck plate 2 and rotationally drive section and the chuck plate 2, a sealed space section 14 is provided in such a way that by supplying compressed air, nitrogen gas, or water to the section 14, the semiconductor wafer 1 fixed on the chuck plate 2 is uniformly loaded over the surface as a whole.


Inventors:
YASHIMA TAKAO
Application Number:
JP1999000103659
Publication Date:
October 24, 2000
Filing Date:
April 12, 1999
Export Citation:
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Assignee:
TAKUSEI KIKAI KK
International Classes:
B24B37/005; B24B37/30; B24B37/32; H01L21/304; (IPC1-7): H01L21/304; B24B37/00
Attorney, Agent or Firm:
Masao Sawada