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Patent Searching and Data


Title:
SENSOR MODULE, MANUFACTURING METHOD OF SENSOR MODULE, AND BLOOD PRESSURE MEASURING DEVICE
Document Type and Number:
Japanese Patent JP2019201978
Kind Code:
A
Abstract:
To provide a sensor module whose surface has high surface smoothness capable of securing high sensor accuracy, a manufacturing method of the sensor module, and a blood pressure measuring device.SOLUTION: A sensor module 63 includes: a pressure sensor part 71; a sensor base 72 including a support wall part 72a in which the pressure sensor part 71 is arranged on one principal surface side, and distribution holes 72d to 72g penetrating from the one principal surface side to the other principal surface side are formed; a sensor head cover 73 including an opening 73a at a position opposed to the sensor 71a, which is arranged on the one principal surface side of the support wall part 72a of the sensor base 72 through a gap 79 communicating with the distribution holes 72d to 72g, and the opening 73a; and a soft part 74 that is arranged at the opening 73a and covers the pressure sensor part 71.SELECTED DRAWING: Figure 20

Inventors:
NAKAGAWA YUKI
NAMBA IWANORI
KONDO KATSUNOBU
HAMAGUCHI TSUYOSHI
FUCHIMOTO TAKASHI
KATAGIRI TAKUYA
Application Number:
JP2018099715A
Publication Date:
November 28, 2019
Filing Date:
May 24, 2018
Export Citation:
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Assignee:
OMRON HEALTHCARE CO LTD
International Classes:
A61B5/022
Attorney, Agent or Firm:
Kurata Masatoshi
Nobuhisa Nogawa
Naoki Kono
Tadashi Inoue
Ukai Ken
Shigeru Iino