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Title:
SENSOR PACKAGE, IMAGING DEVICE, AND PORTABLE ELECTRONIC APPLIANCE
Document Type and Number:
Japanese Patent JP2012028550
Kind Code:
A
Abstract:

To provide a sensor package that can suppress image deterioration caused by temperature fluctuation while attempting space saving, provide an imaging device including the sensor package, and provide a portable electronic appliance including the imaging device.

A sensor package 10 comprises: a flat-plate shaped translucent substrate 12 provided with a metal wire on one surface; a flat-plate shaped solid-state imaging element 9 disposed opposite to the translucent substrate 12 and electrically connected to the metal wire; connection terminals 13, 13... electrically connected to a part of the metal wire that is outside the solid-state imaging element 9; and a flat-plate shaped printed circuit board 14 disposed opposite to the solid-state imaging element 9 and electrically connected thereto by the connection terminals 13, 13.... As for selection of the translucent substrate 12 and the printed circuit board 14, one of the substrates 12 and 14 has a linear expansion coefficient 1-3 times that of the other in the range of a linear expansion coefficient of 3.2(×10-6) to 7.2(×10-6).


Inventors:
TSUDA KOHEI
Application Number:
JP2010000165662
Publication Date:
February 09, 2012
Filing Date:
July 23, 2010
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
H01L27/14; H04N5/369
Domestic Patent References:
JP2007299929A2007-11-15
JP2007288755A2007-11-01
JP2006128625A2006-05-18
Attorney, Agent or Firm:
内藤 浩樹
永野 大介
藤井 兼太郎