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Patent Searching and Data


Title:
SHEET-BY-SHEET TYPE DOUBLE-SIDE LAPPING METHOD
Document Type and Number:
Japanese Patent JP2001038612
Kind Code:
A
Abstract:

To cope with warping occurring at the time of slicing a semiconductive wafer in need of thinned extremely and expanding a diameter, flat and mirror finish working.

This lapping method uses a double-side lapping machine for lapping both the surfaces of a semiconductive wafer W between upper and lower surface plates rotating respectively, a nipping part 1b provided with a circular arc part 1a conformed with the outer periphery of a semiconductive wafer, and thinner than the thickness of the wafer, and a pair of wafer holders 1 provided with a supporting rod 1c extended from the nipping part 1b.


Inventors:
HATANO KOICHI
Application Number:
JP1999000220638
Publication Date:
February 13, 2001
Filing Date:
August 04, 1999
Export Citation:
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Assignee:
MEIJI MACHINE
International Classes:
B24B37/04; B24B37/08; B24B37/30; H01L21/304; (IPC1-7): B24B37/04; H01L21/304