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Title:
SILVER-CONTAINING ALLOY POWDER AND ELECTRIC CONDUCTIVE PASTE USING THIS POWDER
Document Type and Number:
Japanese Patent JPH03247702
Kind Code:
A
Abstract:

PURPOSE: To manufacture Ag alloy powder having excellent electric conductivity, oxidizing resistance and suitable for raw material for electric conductive paste by super-rapidly cooling the specific composition of molten Ag alloy with high pressure atomizing method, solidifying and pulverizing it.

CONSTITUTION: The molten alloy having composition shown with general formula AgXM1-X (wherein, M shown one or more kinds among Cu, Ni, Co and Fe and 0.0005<X<0.01 atomic ratio) is rapidly cooled and solidified with the high pressure water atomizing method or the high pressure gas atomizing method and pulverized into the fine powder-state having 0.1-100μm average particle diameter. The Ag alloy powder having excellent electric conductivity and oxidizing resistance and developing no Ag migration, is obtd. By mixing 5-100wt parts of organic binder of thermoplastic resin or thermosetting resin, etc., to 100wt parts of the Ag alloy fine powder, the conducive paste suitable for use for screen printing, printed circuit forming, electromagnetic shield, capacitor, etc., is manufactured.


Inventors:
YOKOYAMA AKINORI
KATSUMATA TSUTOMU
NAKAJIMA HITOSHI
Application Number:
JP1990000041093
Publication Date:
November 05, 1991
Filing Date:
February 23, 1990
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
B22F1/00; B22F9/08; C09J9/02; C09J11/04; C22C5/06; C22C9/00; C22C19/00; C22C38/00; H01B1/00; H01B1/22; H01C7/00; H01G4/008; H01L21/52; H05K1/09; H05K9/00; (IPC1-7): B22F1/00; C09J9/02; C22C5/06; H01B1/22; H01C7/00; H01G1/01; H01L21/52; H05K1/09; H05K9/00