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Title:
SLIDING CONTACT DEVICE
Document Type and Number:
Japanese Patent JPS63314809
Kind Code:
A
Abstract:

PURPOSE: To improve the reliability of contacting, and lengthen remarkably the working life of a sliding contact device, by using Ag-Cu of 3W10wt.% -Cd of 0.5W5wt.% for the slide contact material fixed on a spring terminal member.

CONSTITUTION: A wiring plate 4 is constituted by arranging an RuO2 thick film resistance pattern 2, and an Au thick film pattern 3 having a specified interval and length, on an Al2O3 substrate 1. For the contact wire material 6 of a moving contact 5 sliding on the Au pattern 3, Ag-Cu of 3W20wt.% -CD of 0.5W5wt.% is used. The hardness of the material is about Hv 110W150, and the material is soft and easy to slide. Therefore, in the case of contacting action, a conductor pattern of the Au system thick film is prevented from abrading, cohering and exfoliating, so that the reliability of contacting is improved, and the working life of the device is remarkably lengthened.


Inventors:
MIZUKAMI SHIGEO
Application Number:
JP15167787A
Publication Date:
December 22, 1988
Filing Date:
June 18, 1987
Export Citation:
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Assignee:
TANAKA PRECIOUS METAL IND
International Classes:
H01C1/12; H01C10/08; H01H1/04; H01R39/20; (IPC1-7): H01C1/12; H01C10/08; H01H1/04; H01R39/20



 
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