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Title:
SLITTER DEVICE AND MANUFACTURING METHOD FOR ELECTRODE
Document Type and Number:
Japanese Patent JP2006007404
Kind Code:
A
Abstract:

To sufficiently restrain cut chips of a collector from being melted on an upper blade side surface at the time of cutting a sheet-typed electrode, and sufficiently restrain generation of burrs at the cut surface of the collector.

A rotating shaft 2 on which one or more upper blades 4 are installed and a rotating shaft 5 to which one or more lower blades 7 are installed are disposed in parallel to each other so that a periphery side surface 4a of the upper blade 4 and a periphery side surface 7a of the lower blade 7 are brought into contact with each other to obtain a prescribed bite depth. The thickness of the upper blade 4 is ≥1 mm, a blade top angle of the upper blade 4 is 75 to 88°, the hardness of the upper blade 4 and the lower blade 7 is ≤6.9×103 to 8.8×103 N/mm2, a gap between the hardness of the upper blade 4 and the hardness of the lower blade 7 is ≤4.9×102 N/mm2, surface roughness of the upper blade 4 and the lower blade 7 is ≤4 μm, and the gap between the surface roughness of the upper blade 4 and the surface roughness of the lower blade 7 is ≤2 μm.


Inventors:
KATAI KAZUO
MIYAKI YOUSUKE
ENDO SEIICHI
Application Number:
JP2004192203A
Publication Date:
January 12, 2006
Filing Date:
June 29, 2004
Export Citation:
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Assignee:
TDK CORP
International Classes:
B26D1/24; B26D1/20; H01M4/139
Domestic Patent References:
JP2002343343A2002-11-29
JP2002273690A2002-09-25
JP2001212788A2001-08-07
JPH05212695A1993-08-24
JP2001062773A2001-03-13
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Hiroaki Aoki
Takashi Mikami



 
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