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Title:
SLURRY COMPOSITION
Document Type and Number:
Japanese Patent JP2011026371
Kind Code:
A
Abstract:

To provide a slurry composition achieving excellent dispersibility without adding a dispersant and giving high strength of a film material obtained from the composition, and to provide a ceramic paste, a conductive paste, a magnetic powder paste, a glass paste, a paste for a heat-developable photosensitive material and a phosphor paste obtained by using the slurry composition.

The slurry composition contains an inorganic powder and a polyvinyl acetal resin, wherein the polyvinyl acetal resin contains a modified polyvinyl acetal resin having structural units expressed by at least a vinyl alcohol unit, a vinyl acetal unit, a vinyl acetate unit and a unit having 1,2-diol expressed by formula (5), and the modified polyvinyl acetal resin contains the structural unit expressed by the formula by 0.05 to 2.0 mol%.


Inventors:
OTSUKI KENICHI
HIROSE YUKI
Application Number:
JP2009170323A
Publication Date:
February 10, 2011
Filing Date:
July 21, 2009
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L29/14; B41M5/337; C04B35/632; C08F216/38; C08K3/00; C09K11/02; H01B1/22; H01G4/12
Domestic Patent References:
JP2007297613A2007-11-15
JP2006104309A2006-04-20
JP2004068014A2004-03-04
Foreign References:
WO2007114472A12007-10-11
Attorney, Agent or Firm:
Atomi International Patent Office