Title:
Sn-Cu ALLOY PLATING BATH AND Sn-Cu ALLOY PLATING METHOD
Document Type and Number:
Japanese Patent JP2002241987
Kind Code:
A
Abstract:
To provide an Sn-Cu alloy plating bath which is a sulfuric acid bath consisting of sulfuric acid, a tin compound and a copper compound, and which enables the deposition of a dense Sn-Cu alloy plating film having good adhesion by electroplating.
The Sn-Cu alloy plating film enables the deposition of an Sn-Cu alloy plating film which does not substantially contain lead on the object to be plated by electroplating. The plating bath is compounded with sulfuric acid, a tin compound, a copper compound and an N,N-bis(polyoxyethylene)alkylamine compound shown by the formula: CnH2n+1[(CH2CH2O)mH]2 (wherein, n=10, to 20, and m=2 to 10).
Inventors:
KANEKO NORIO
ARAI SUSUMU
SHINOHARA NAOYUKI
WAKABAYASHI SHINICHI
ARAI SUSUMU
SHINOHARA NAOYUKI
WAKABAYASHI SHINICHI
Application Number:
JP2001044959A
Publication Date:
August 28, 2002
Filing Date:
February 21, 2001
Export Citation:
Assignee:
SHINKO ELECTRIC IND CO
International Classes:
C25D3/60; (IPC1-7): C25D3/60
Attorney, Agent or Firm:
Takao Watanuki (1 outside)