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Title:
SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE
Document Type and Number:
Japanese Patent JP2020157313
Kind Code:
A
Abstract:
To provide a solder composition having excellent wettability and sufficient storage stability.SOLUTION: A solder composition contains: a flux composition containing (A) a rosin-based resin, (B) an activator and (C) a solvent; and (D) solder powder, in which the (B) component contains (B1) a hydroxyl group-containing bromine-based activator and (B2) an amine adduct compound.SELECTED DRAWING: None

Inventors:
USUKURA SHINICHI
YOSHIZAWA SHINJI
IWABUCHI MITSURU
Application Number:
JP2019056457A
Publication Date:
October 01, 2020
Filing Date:
March 25, 2019
Export Citation:
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Assignee:
TAMURA SEISAKUSHO KK
International Classes:
B23K35/363
Domestic Patent References:
JP2013046929A2013-03-07
JP2003164992A2003-06-10
JP2001138089A2001-05-22
JP2018140437A2018-09-13
Foreign References:
WO2012081688A12012-06-21
WO2016199747A12016-12-15
Attorney, Agent or Firm:
Intellectual Property Office



 
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