PURPOSE: To prevent the generation of Manhattan phenomena and facilitate visual inspection of the quality of soldering by forming a land projection section which extends from chip components so that the width may be narrowed compared with the land width of a land main body which responds with a soldered part of the chip component.

CONSTITUTION: A pair of solder lands 11 which respond with a pair of soldered parts of a chip component 3 is formed on a substrate in projected shape. The solder lands 11 are formed so that the land width 13w of a projected part 13 which extends from the chip component 3 may be narrowed in contrast with the land width 12w of a land body 12 formed in the same shape with the soldered part 4 of the chip component 3. Therefore, a Manhattan promotion moment based on the surface tension of molten solder acting between the soldered part 4 of the chip component 3 and the land projection part 13 of the solder land 11 is reduced by a reduced portion of the land width 13. In addition, the moisturized state of the solder land 11 is confirmed at the land projection part 13. This construction makes it possible to prevent the generation of Manhattan phenomena and facilitate visual inspection of the quality of soldered parts.