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Patent Searching and Data


Title:
SOLDER PASTE COMPOSITION
Document Type and Number:
Japanese Patent JP2007044740
Kind Code:
A
Abstract:

To provide a solder paste composition, which suppresses breakage of a bump and forms a bump with high yield and uniform height by a solder precoat method using a dam.

The solder precoat method using a solder paste composition 5 is carried out as follows: a dam 4 is formed around electrodes 2 on a substrate 1; an opening surrounded by the dam 4, in which the electrodes 2 are positioned, is filled with the solder paste composition 5; and the solder paste composition 5 put in the opening is heated and adhered to the surfaces of the electrodes 2, so that a solder bump 6 is formed. The solder paste composition contains solder powder, and the particle size distribution of the solder powder is as follows: particles having <10 μm diameter is ≥16%; and the total of particles having <10 μm diameter and particles having ≥10 μm and <20 μm is ≥90%.


Inventors:
SAKURAI HITOSHI
KUKIMOTO YOICHI
Application Number:
JP2005000233111
Publication Date:
February 22, 2007
Filing Date:
August 11, 2005
Export Citation:
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Assignee:
HARIMA CHEMICALS INC
International Classes:
B23K35/22; H05K3/34; B23K1/00; B23K35/26; B23K101/42; C22C13/00
Attorney, Agent or Firm:
深井 敏和