To provide a soldering method which ensures soldering with the excellent wettability of solder, and to provide a soldered body which ensures also the excellent wettability of solder.
There is provided a soldering method for soldering an electronic component, in which a palladium layer or a palladium alloy layer is formed on its surface and a lead terminal for soldering is included, to a printed wiring board 101 including soldering lands and plated through holes. The solder 109 is supplied to the lands and through holes by forming a solder layer which is mainly composed of tin and zinc to the surface of the lands and through holes by a HAL process, mounting the lead terminal by inserting into the through hole, and placing the printed wiring board 101 in contact with injected flow waves 112, 115 of the solder mainly composed of tin and zinc.
TERADA HIROAKI
SUGIURA MASAHIRO
MIZUTANI TETSUJI
IMAMURA KEIICHIRO
TANAKA TAKASHI
NEC TOPPAN CIRCUIT SOLUTIONS TOYAMA INC
SORUDAA KOOTO KK
MARUYA SEISAKUSHO KK
NIHON DENNETSU KEIKI CO LTD
ARAKAWA CHEM IND