Title:
SOLDERING METHOD
Document Type and Number:
Japanese Patent JPH0592293
Kind Code:
A
Abstract:
PURPOSE: To provide a soldering method which can suppress oxide from being generated on the surface of molten solder, therefore, reduce generation of defects of soldering caused by an oxide.
CONSTITUTION: Solder foil in the shape of thin film is interposed, the atmosphere of this part to be soldered is made a non-oxidizing atmosphere having a concentration of oxygen ≤400ppm and this part to be soldered is heated, this solder foil is melted and soldered.
Inventors:
MORI AKIRA
ISHII TOSHINORI
MORIKAWA MASAKI
YOSHIDA HIDEAKI
ISHII TOSHINORI
MORIKAWA MASAKI
YOSHIDA HIDEAKI
Application Number:
JP15718291A
Publication Date:
April 16, 1993
Filing Date:
June 27, 1991
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B23K31/02; H01L21/52; B23K101/40; (IPC1-7): B23K31/02; B23K101/40; H01L21/52
Attorney, Agent or Firm:
Masatake Shiga (2 outside)