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Title:
SPUTTERING APPARATUS
Document Type and Number:
Japanese Patent JPS6119773
Kind Code:
A
Abstract:

PURPOSE: To enhance cooling effect and to prevent the generation of spattering, by reducing the thickness of the cooling member contacted with a sputtering target to make said cooling member deformable in conformity with the deformation of the target.

CONSTITUTION: A sputtering apparatus is constituted by arranging a sputtering target 3 to one surface of a cooling member 21' having good heat conductivity and forming the passage 28 of a cooling liquid so that said cooling liquid is flowed so as to be contacted with the other surface of said cooling member 21'. The aforementioned cooling member 21' is formed in a thickness for permitting deformation and, even if the aforementioned target 3 is deformed, said member 21' is deformed by the pressure of the cooling liquid to be contacted with the target 3.


Inventors:
NAKAMURA HIROSHI
NAGATOMO HIROTO
Application Number:
JP13716884A
Publication Date:
January 28, 1986
Filing Date:
July 04, 1984
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C23C14/34; H01L21/203; H01L21/285; (IPC1-7): C23C14/34; H01L21/203; H01L21/285