Title:
SPUTTERING DEVICE
Document Type and Number:
Japanese Patent JP3657026
Kind Code:
B2
Abstract:
PURPOSE: To provide a sputtering device in which a sputtered film deposited on a shield member is hard to separate and the scattering of a separated fine powder can be effectively prevented.
CONSTITUTION: An electrode 2 with a target 1 mounted on and an electrode 4 with a wafer 3 held to are disposed in opposite to each other in a chamber 5, and when the target 1 is sputtered by applying a voltage between both electrodes 2, 4 to form a sputter film on the wafer 3, the scattering of sputter particles in the direction other than that from the target 1 to the wafer 3 can be prevented by a shield member 20 provided in the vicinity of the circumferential edge part 1a of the target 1. The tip part 22 of the shield member 20 extending above the circumferential edge 1a of the target 1 is formed in a circular-arc form having a fixed radius and also the inner wall part 23 of the shield member 20 surrounding the outer part of the circumferential edge 1a of the target 1 is formed in a circular-arc form having a fixed radius.
Inventors:
Yamato Sako
Yoshiaki Toba
Haruhisa Ogawa
Masami Shigeta
Yoshiaki Toba
Haruhisa Ogawa
Masami Shigeta
Application Number:
JP12423495A
Publication Date:
June 08, 2005
Filing Date:
April 25, 1995
Export Citation:
Assignee:
Unihua Electronics Co., Ltd.
International Classes:
H01L21/203; C23C14/34; (IPC1-7): H01L21/203; C23C14/34
Domestic Patent References:
| JP5027047U | ||||
| JP5082444A | ||||
| JP4013868A | ||||
| JP3013564A | ||||
| JP4188725A | ||||
| JP5195218A | ||||
| JP5279845A | ||||
| JP7126832A |
Attorney, Agent or Firm:
Takayoshi Kokubun
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