SPUTTERING FILM FORMING DEVICE

Title:

SPUTTERING FILM FORMING DEVICE

Document Type and Number:

Japanese Patent JPH0790570

Kind Code:

A

Abstract:

PURPOSE: To prepare a grown film enhanced in hydrogen concn. uniformity by impressing a voltage between a shutter and a susceptor only when the shutter is inserted between a target electrode and the susceptor.

CONSTITUTION: A target electrode 1 capable of being heated and a substrate 4 opposed to the electrode are set in a chamber 6. The target electrode is connected to a high-frequency power source 3 through a matching box 2. A gas inlet line 7 and a gas outlet line 8 are provided to the chamber 6. A shutter 5 is arranged between the target electrode 1 and the substrate 4. A voltage is impressed between the shutter 5 and the susceptor 4 from a second power source only when the shutter 5 is inserted between the target electrode 1 and the susceptor (substrate 4). The inside of the device is easily cleaned in this way.

More Like This:

JPS52145380	SPUTTERING APPARATUS
JP3971293	STACKED FILM HAVING EXCELLENT WEAR RESISTANCE AND HEAT RESISTANCE, PRODUCTION METHOD THEREFOR, AND STACKED FILM-COATED TOOL HAVING EXCELLENT WEAR RESISTANCE AND HEAT RESISTANCE
JP2011032533	REFLECTION FILM LAMINATED BODY

Inventors:

ICHINOSE HIDEO

Application Number:

JP23703793A

Publication Date:

April 04, 1995

Filing Date:

September 24, 1993

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TOSHIBA CORP

International Classes:

C23C14/34; H01L21/203; H01L21/31; (IPC1-7): C23C14/34; H01L21/203; H01L21/31

Attorney, Agent or Firm:

Norio Ogo

Next Patent: PRODUCTION OF ZIRCONIUM NITRIDE EXCELLENT IN DECORATIVENESS AND ADHESION PROPERTY