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Patent Searching and Data


Title:
SPUTTERING FILM FORMING DEVICE
Document Type and Number:
Japanese Patent JPH0790570
Kind Code:
A
Abstract:

PURPOSE: To prepare a grown film enhanced in hydrogen concn. uniformity by impressing a voltage between a shutter and a susceptor only when the shutter is inserted between a target electrode and the susceptor.

CONSTITUTION: A target electrode 1 capable of being heated and a substrate 4 opposed to the electrode are set in a chamber 6. The target electrode is connected to a high-frequency power source 3 through a matching box 2. A gas inlet line 7 and a gas outlet line 8 are provided to the chamber 6. A shutter 5 is arranged between the target electrode 1 and the substrate 4. A voltage is impressed between the shutter 5 and the susceptor 4 from a second power source only when the shutter 5 is inserted between the target electrode 1 and the susceptor (substrate 4). The inside of the device is easily cleaned in this way.


Inventors:
ICHINOSE HIDEO
Application Number:
JP23703793A
Publication Date:
April 04, 1995
Filing Date:
September 24, 1993
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
C23C14/34; H01L21/203; H01L21/31; (IPC1-7): C23C14/34; H01L21/203; H01L21/31
Attorney, Agent or Firm:
Norio Ogo