Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
成形金型の刻印装置
Document Type and Number:
Japanese Patent JP4140124
Kind Code:
B2
More Like This:
WO/2005/087305METHODS AND MOULDS FOR USE IN FABRICATING SIDE-PORTED MICRONEEDLES
WO/2009/151405METHOD OF MAKING A SUBSTRATE HAVING MULTI -LAYERED STRUCTURES
JPH085076INDUSTRIAL APPLICABILITY: Foam molding method and molding mold
Inventors:
Hiroaki Maru
Application Number:
JP9215099A
Publication Date:
August 27, 2008
Filing Date:
March 31, 1999
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Futaba Electronics Co., Ltd.
International Classes:
B29C33/42; B41K3/36; B29C45/37
Domestic Patent References:
JP9512508A
JP7039936A
JP58138606U
JP10264161A
JP2000167850A
Attorney, Agent or Firm:
Norimitsu Nishimura



 
Previous Patent: 炭化珪素単結晶の製造方法及び単結晶製造装置

Next Patent: SIMULTANEOUSLY BIAXIALLY STRETCHING DEVICE OF SHEET-LIKE MATERIAL