PURPOSE: To easily form a substrate having no distortion of transfer without requiring severe conditions for the stamper when a substrate is formed, by forming a specified recess or projection pattern on the stamper surface except for preformat pits and a groove pattern.

CONSTITUTION: The surface of the stamper has a recess or projection pattern on the whole or a part of the front and rear surfaces except at least preformat pits and a groove pattern. The recess or projection pattern gives enough small roughness than the preformat pits so that the pattern does not prevent readout of the preformat pattern signals nor increases noises. For example, it is necessary that the recess or projection has ≤1/3 diameter of the preformat pit and ≤1/10 height (depth). Preferably, the recess or projection pattern is formed in the flat area except for the preformat pits and the groove pattern in 100-1000 number/μm2 density, and each recess or projection has 5-50nm diameter and 1-10nm height (depth).