PURPOSE: To suppress the variation in plating thickness and to improve maintainability by vertically moving and oscillating a material to be plated opposed to an insoluble anode in a plating tank and jetting a plating soln. into the plating tank.

CONSTITUTION: A material 1 to be plated is received by a clawlike receiving jig in a plating tank 8, and a cathode 4 is pressed on the material 1 by means of a rotating and oscillating actuator 6. Meanwhile, a plus electrode 15 is totally formed with an insoluble anode 10 opposed to the cathode 4 and a plating material 11 (solder, etc.) in a standby tank 9. The plating soln. in the standby tank 9 is always cleaned by a filter 12, injected into the plating tank 8 by a pump through an injection nozzle 16 and circulated to the standby tank 9. The material 1 is plated by this constitution, hence the variation in plating thickness is suppressed, and maintainability is improved.