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Patent Searching and Data


Title:
WRITING INSTRUMENT
Document Type and Number:
Japanese Patent JP2022030823
Kind Code:
A
Abstract:
To provide a writing instrument provided with resin component that gives a moist feeling as if holding a lacquer ware.SOLUTION: There is provided a writing instrument comprising writing instrument component. The writing instrument component is located on the outer surface of the writing instrument. The writing instrument component is made of a resin molded product with a water absorption rate of 0.8% or more. The surface roughness of the writing instrument component is 0.020 μm or less in arithmetic average roughness (Sa).SELECTED DRAWING: Figure 2

Inventors:
TAKAHASHI RYOTA
ONISHI TOMOATSU
Application Number:
JP2020135091A
Publication Date:
February 18, 2022
Filing Date:
August 07, 2020
Export Citation:
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Assignee:
PILOT CORP
International Classes:
B43K7/00; B43K3/00; B43K5/00