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Patent Searching and Data


Title:
STRUCTURE OF LAMINATED DIE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2002001457
Kind Code:
A
Abstract:

To provide structure of a laminated die having high dimensional accuracy, rigidity to a laminated direction and durability through a smooth surface, and its manufacturing method.

In the laminated die consecutively laminating metal sheets being cut off based on slicing data for each thickness of metal sheets supplied from three dimensional CAD data, the die gas a three dimensional curved surface portion, an intensified member and a guide function portion, and the three dimensional curved surface portion has a laminated structure alone. Errors due to thickness variation of metal plates are absorbed by pressurization at a predetermined height by filling up filler among metal plates to be laminated. Further, in structure of the die and its manufacturing method for the outer plate, a recessed pattern outer plate material, a product processing material and projecting pattern outer plate material are formed in piles in the laminated die cutting metal sheets in which projecting pattern is shifted inside by the thickness of an outer plate only and a recessed pattern is shifted outside against the three dimensional CAD data. The outer plates are then fixed on the projecting and recessed patterns.


Inventors:
YAMAZAKI HISAO
ANAYAMA TOSHIFUMI
Application Number:
JP2000184167A
Publication Date:
January 08, 2002
Filing Date:
June 20, 2000
Export Citation:
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Assignee:
ANAYAMA CREATE KK
YAMAZAKI HISAO
NAKAGAWA TAKEO
NANKO KK
International Classes:
B21D37/20; B29C33/38; (IPC1-7): B21D37/20; B29C33/38