Title:
SUBSTRATE FIXING DEVICE OF ELECTRONIC PART MOUNTING DEVICE, ETC.
Document Type and Number:
Japanese Patent JP3691869
Kind Code:
B2
Abstract:
PURPOSE: To fix a substrate accurately by a simple mechanism by providing a substrate lift height setting means which sets a lift height of a transferred substrate at a desired lift height.
CONSTITUTION: A substrate fixing device has an air cylinder 30 as a substrate lift means and a supporting board 31 which is lifted by the air cylinder 30. The substrate fixing device is further provided with a pair of brackets 34, 34 fixed on a base 32 by a volt 33. A rotary shaft 35 is supported rotatably in a horizontal direction near an upper end between the brackets 34, 34. The rotary shaft 35 is rotated by, for example, rotating a graduated knob 36. Setting of a lift height of a printed board can be numerically controlled through numerical control of a rotation amount of the rotary shaft 35 by using graduations of the knob 36. The height of an upper surface of a printed board can be maintained fixed by keeping cams 37, 37 rotating by the knob 36 according to the thickness of a printed board 20.
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Inventors:
Teruhiko Fujioka
Akira Okawa
Akira Okawa
Application Number:
JP3415895A
Publication Date:
September 07, 2005
Filing Date:
February 22, 1995
Export Citation:
Assignee:
Samsung Techwin Co., Ltd
International Classes:
B23P21/00; B23Q7/00; H05K13/00; H05K13/04; (IPC1-7): H05K13/04
Domestic Patent References:
| JP4107899U | ||||
| JP2146900U | ||||
| JP1146400A | ||||
| JP5206699A | ||||
| JP5129799A | ||||
| JP3066200A |
Attorney, Agent or Firm:
Yamato Tsutsui
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