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Patent Searching and Data


Title:
SUBSTRATE TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP2011202865
Kind Code:
A
Abstract:

To provide the shape capable of suppressing disconnection and the like of a heating element, and further suppressing deformation of a holding body due to self weight and the like of the heating element.

This substrate treatment device includes a treatment chamber disposed in a heating chamber for treating a substrate, and a heating device for heating the inside of the heating chamber. The heating device includes the heating element 42 configured so that a plurality of peak sections 42a and trough sections 42b are lined respectively at upper and lower ends and its both ends are fixed, a heat insulator 33 configuring a part of the heating chamber and disposed on an outer periphery of the heating element 42, and a holding body 41 fixed to the heat insulator 33 and holding the heating element 42, at least a part of the peak sections 42a of the heating element 42 is bent to a heat insulator 33 side, and the heat insulator 33 includes a projecting section 51 projecting toward a heating element 42 side at a part opposing to the trough sections 42a of the heating element 42 and supporting the holding body 41.


Inventors:
MURATA HITOSHI
KOSUGI TETSUYA
SUGIURA SHINOBU
Application Number:
JP2010000069895
Publication Date:
October 13, 2011
Filing Date:
March 25, 2010
Export Citation:
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Assignee:
HITACHI INT ELECTRIC INC
International Classes:
F27D11/02; C23C16/46; H01L21/205; H01L21/22; H01L21/31; H01L21/324
Attorney, Agent or Firm:
油井 透
阿仁屋 節雄
清野 仁
福岡 昌浩