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Title:
SUBSTRATE TREATMENT METHOD AND APPARATUS THEREOF, AND REMOVING AGENT USED FOR THE SAME METHOD AND APPARATUS
Document Type and Number:
Japanese Patent JP2003338679
Kind Code:
A
Abstract:

To provide a method and an apparatus for treating a substrate for making easier the treatment of treatment liquid to remove resin dregs on the substrate and ensuring to lower a risk by safe treatment, and to provide a removing agent for removing the resin dregs.

There are provided a method and an apparatus for treating a substrate and a removing agent with which, when holes are formed in the substrate 1 including resin using a laser or the like, resin dregs generated in the holes are removed in a removing vessel 11. The removing agent (treatment liquid) composed of one element or the combination of a plurality of elements of 2-(2-aminoethoxy) ethanol, hydroxylamine and catechol is reserved in the removing vessel 11, and the substrate 1 is then soaked into the removing agent to remove the resin dregs. Moreover, the removing vessel 11 is further provided with a water-cleaning vessel 12 for washing, after the removal of the resin dregs, the substrate 1 adhered with the removing agent by being soaked into clean washing liquid such as water and a drying vessel 13 for drying the substrate 1 after cleaning by water.


Inventors:
ANDO HIDEKAZU
SHIMADA KIYOSHI
TAKISHITA KAZUHIRO
Application Number:
JP2002145261A
Publication Date:
November 28, 2003
Filing Date:
May 20, 2002
Export Citation:
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Assignee:
SHIMADA PHYSICAL CHEM IND CO
MITSUBISHI ELECTRIC CORP
International Classes:
B08B3/02; B08B3/08; B08B3/10; B08B3/12; C11D7/26; C11D7/32; H05K3/26; (IPC1-7): H05K3/26; B08B3/02; B08B3/08; B08B3/10; B08B3/12; C11D7/26; C11D7/32
Attorney, Agent or Firm:
Hagiwara Makoto