To provide a method and an apparatus for treating a substrate for making easier the treatment of treatment liquid to remove resin dregs on the substrate and ensuring to lower a risk by safe treatment, and to provide a removing agent for removing the resin dregs.
There are provided a method and an apparatus for treating a substrate and a removing agent with which, when holes are formed in the substrate 1 including resin using a laser or the like, resin dregs generated in the holes are removed in a removing vessel 11. The removing agent (treatment liquid) composed of one element or the combination of a plurality of elements of 2-(2-aminoethoxy) ethanol, hydroxylamine and catechol is reserved in the removing vessel 11, and the substrate 1 is then soaked into the removing agent to remove the resin dregs. Moreover, the removing vessel 11 is further provided with a water-cleaning vessel 12 for washing, after the removal of the resin dregs, the substrate 1 adhered with the removing agent by being soaked into clean washing liquid such as water and a drying vessel 13 for drying the substrate 1 after cleaning by water.
SHIMADA KIYOSHI
TAKISHITA KAZUHIRO
MITSUBISHI ELECTRIC CORP