Title:
Support and the supporting structure for an electric wire and cables
Document Type and Number:
Japanese Patent JP6012734
Kind Code:
B2
Abstract:
A two-component device for supporting and retaining a cable or wire bundle in a channel comprises support part with a support surface in which is formed an elongate recess for a cable tie. The upper part lifts on to a lower part and it secured to the floor of the channel, by means of rivets or the like. The support part has an integral tie bar extending across the elongate recess. The lower part has a corresponding tie bar extending across it, between opposed side walls of the lower part. With the wire bundle in place, the cable tie is passed around it and through the recess, passing under the respective tie bars and secured at to hold the bundle in place against the support, at the same time holding the two parts of the support together.
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Inventors:
Iris, Jonathan Mark
Virgilio, Giuliano
Virgilio, Giuliano
Application Number:
JP2014529063A
Publication Date:
October 25, 2016
Filing Date:
September 03, 2012
Export Citation:
Assignee:
Tyco Electronics UK Limited
International Classes:
H02G3/30; B64D41/00
Domestic Patent References:
| JP2010004606A | ||||
| JP2002281647A | ||||
| JP2001208281A |
Foreign References:
| US20050196121 | ||||
| US20100294896 |
Attorney, Agent or Firm:
Tyco Electronics Corporation