Title:
SUPPORTING DEVICE, SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2015081764
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a supporting device, a substrate processing device having the supporting device and a substrate processing method in which a thermal distribution at the substrate can be kept uniformly during a heating process.SOLUTION: A supporting unit of this invention comprises a supporting body extending in a vertical direction by a prescribed length only and arranged and having a substrate mounted thereon and a fitting body arranged in the supporting body. With this arrangement, before the substrate is loaded into a processing chamber, the supporting unit is pre-heated to the same as or similar to a processing temperature for the substrate by a direct heating method or an indirect heating method to enable heat loss of the substrate through the supporting unit to be restricted or prevented. Accordingly, quality of the manufactured substrate can be improved, yield of the substrate can be increased, and efficiency and productivity of a processing device can be increased.
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Inventors:
JI SANG-HYUN
Application Number:
JP2014211845A
Publication Date:
April 27, 2015
Filing Date:
October 16, 2014
Export Citation:
Assignee:
AP SYSTEMS INC
International Classes:
F27D5/00; F27D11/02
Domestic Patent References:
| JPH0917742A | 1997-01-17 | |||
| JPH11204237A | 1999-07-30 | |||
| JP2002175868A | 2002-06-21 | |||
| JPS4816441U | 1973-02-24 | |||
| JP2005093621A | 2005-04-07 | |||
| JP2007242709A | 2007-09-20 | |||
| JP2001199791A | 2001-07-24 |
Attorney, Agent or Firm:
Maeda patent office