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Title:
SURFACE MOUNTING COMPONENT
Document Type and Number:
Japanese Patent JPH05259354
Kind Code:
A
Abstract:

PURPOSE: To provide a surface mounting component which can widen a gap between soldering pads provided on a printed wiring board where to fit the surface mounting component when the interval of leads provided in this surface mounting component is the same as that in a prior art.

CONSTITUTION: A plurality of leads 2 projecting outward are provided with a wide plane made parallel with the wide plane of a rectangular parallelopiped main body 1 from a side end plane orthogonal to the wide plane of the main body 1. A twist part 6 resulting from bending a wide plane of the above- mentioned lead 2 by 90° at a fixed distance from a side end plane in a vertical direction to one wide plane of the main body, and the middle part between this bent wide plane part and an open end part by 90° in a direction orthogonal to the longitudinal direction of a lead 2 is provided, and the open end of the lead 2 is bent 90° so that the tip may turn to the opposite side to the main body 1 within a wide plane.


Inventors:
越地 広昭
Application Number:
JP1992000053128
Publication Date:
October 08, 1993
Filing Date:
March 12, 1992
Export Citation:
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Assignee:
日本電気株式会社
International Classes:
H01L23/50; H05K1/18; H05K3/34; (IPC1-7): H01L23/50; H05K1/18
Attorney, Agent or Firm:
京本 直樹 (外2名)



 
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