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Title:
SYNTHETIC RESIN COMPOSITION HAVING HIGH THERMAL CONDUCTIVITY AND HIGH THERMAL CONDUCTIVITY IMPROVER
Document Type and Number:
Japanese Patent JP3482057
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a synthetic resin composition, having a high thermal conductivity and useful especially as an encapsulant for electronic materials by blending a synthetic resin with magnesium hydroxide having specific properties and a high thermal conductivity improver in respective specific proportions.
SOLUTION: This synthetic resin composition having a high thermal conductivity is obtained by blending (A) 100 pts.wt. synthetic resin with (B) 0-400 pts.wt. magnesium hydroxide having ≤3.0×10-3 strain in the <101> direction in an X-ray diffractometry and ≤20m2/g specific surface area according to the BET method, (C) 0-400 pts.wt. fibrous magnesium hydroxide having ≥2.5 ratio of the length/diameter and ≥1μm length and ≤20m2/g specific surface area according to the BET method and (D) 0-100 pts.wt. high thermal conductivity improver. The total amount of the blended components (B) and (C) is 50-400 pts.wt. Either or both of the surfaces of the components (B) and (C) are preferably treated with a surface treating agent. Furthermore, both the components (B) and (C) are thermal conductivity improving agents.


Inventors:
Manabe, Hitoshi
Imahashi, Takeshi
Katsuki, Keiko
Application Number:
JP1995000334752
Publication Date:
December 22, 2003
Filing Date:
December 22, 1995
Export Citation:
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Assignee:
KYOWA CHEM IND CO LTD
International Classes:
C08K3/22; C08K7/00; C08K7/02; C08K7/08; C08K9/04; C08L101/00; (IPC1-7): C08K3/22; C08K7/08; C08K9/04; C08L101/00
Attorney, Agent or Firm:
大島 正孝