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Title:
SYNTHETIC RESIN MOLDING HAVING TWO-LAYER SHEET
Document Type and Number:
Japanese Patent JP2011083954
Kind Code:
A
Abstract:

To provide a synthetic resin molding which is obtained by integral molding of synthetic resin sheets and is hard to cause warpage due to the difference of thermal expansion and contraction without apply ing any annealing.

After charging the synthetic resin sheets by adjoining to a metal mold surface, a molten resin is injected into a metal mold to obtain the synthetic resin molding 1 in which welding joining of the synthetic resin sheets are carried out. The synthetic resin molding is equipped with a first synthetic resin sheet 20 at least on one surface of which an ink film layer 21 is formed, a synthetic resin plate 10 obtained by welding joining of the first synthetic resin sheet 20 with a first surface 10a and a second synthetic resin sheet 30 obtained by welding joining of the first surface 10a of the synthetic resin plate 10 with a second surface 10b thereof having a front and back relation.


Inventors:
SHINO TETSUHIRO
YOSHIZAKA KIMIYASU
Application Number:
JP2009238117A
Publication Date:
April 28, 2011
Filing Date:
October 15, 2009
Export Citation:
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Assignee:
SAKAIYA KK
International Classes:
B29C45/14
Domestic Patent References:
JP2005103998A2005-04-21
Attorney, Agent or Firm:
Yuzo Yamazaki
Naoto Sugiyama
Shirogane Expo
Toshiaki Akamatsu
Okuko Masako
Ono Wataru
Tadao Naito
Katsuaki Tsunemitsu
Asako Ando
Hirofumi Higashino
Takeko Miko



 
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