Title:
SYSTEM AND METHOD FOR ACHIEVING UNIFORMITY ACROSS REDISTRIBUTION LAYER
Document Type and Number:
Japanese Patent JP2017216443
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a system and a method for achieving uniformity across a redistribution layer.SOLUTION: The method for achieving uniformity across a redistribution layer includes patterning a photoresist layer 108 over a substrate. The patterning defines a region for a conductive wire and a via arranged below the region for a conductive wiring. The method further includes depositing a conductive material in between the patterned photoresist layer, such that the conductive material fills the via 106 and the region for the conductive wiring. The depositing causes an overgrowth of conductive material of the conductive wiring to form a bump 114 of the conductive material over the via. The method also includes planarizing a top surface of the conductive wiring while maintaining the patterned photoresist layer present over the substrate. The planarizing is facilitated by exerting a horizontal shear force over the conductive wiring and the bump. The planarizing is performed to flatten the bump.SELECTED DRAWING: Figure 3
Inventors:
BRYAN L BUCKALEW
THOMAS A PONNUSWAMY
STEVEN T MAYER
STEPHEN J BANIK II
JUSTIN OBERST
THOMAS A PONNUSWAMY
STEVEN T MAYER
STEPHEN J BANIK II
JUSTIN OBERST
Application Number:
JP2017095280A
Publication Date:
December 07, 2017
Filing Date:
May 12, 2017
Export Citation:
Assignee:
LAM RES CORP
International Classes:
H01L21/60; H01L21/3205; H01L21/321; H01L21/768; H01L23/12; H01L23/522; H01L23/532
Attorney, Agent or Firm:
Meisei International Patent Office
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