SYSTEM FOR SCHEDULING WAFER MOVEMENT IN WAFER TREATMENT TOOL, AND ITS METHOD

Title:

SYSTEM FOR SCHEDULING WAFER MOVEMENT IN WAFER TREATMENT TOOL, AND ITS METHOD

Document Type and Number:

Japanese Patent JP2007005822

Kind Code:

A

Abstract:

To provide a system for scheduling wafer movement in a wafer treatment tool, and its method.

This wafer treatment tool (100) comprises a load module (102), wafer transfer unit (104), treatment module (116) and scheduler (118). The scheduler (118) is structured to generate the schedule of a wafer movement in the wafer treatment tool (100) based on the time duration of operations performed by the wafer transfer unit (104) and the treatment module (116) when a wafer is treated.

Inventors:

JOMA KENTARO
OKI TATSUYA

Application Number:

JP2006229617A

Publication Date:

January 11, 2007

Filing Date:

August 25, 2006

Export Citation:

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Assignee:

TOKYO ELECTRON LTD

International Classes:

H01L21/02; G05B19/418; G06Q50/00

Domestic Patent References:

JPH096857A	1997-01-10
JPH097912A	1997-01-10
JPH06176032A	1994-06-24
JPH02117512A	1990-05-02
JPH10207525A	1998-08-07
JP2001068391A	2001-03-16
JP2000286176A	2000-10-13

Attorney, Agent or Firm:

Atsushi Aoki
Jun Tsuruta
Tetsuro Shimada
Koichi Itsubo

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