Title:
TAKE-OUT MECHANISM FOR SEMICONDUCTOR WAFER IN CARRIER CASE
Document Type and Number:
Japanese Patent JP3898804
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a take-out mechanism for a semiconductor wafer in a carrier case whereby proper work for taking out the semiconductor wafer can be performed, the semiconductor wafer and a cushioning sheet can be accurately separated.
SOLUTION: A device comprises a mounting base 2 loading in a liftable manner a carrier case 70 of semiconductor wafers W stored to be layered by interposing cushioning sheets P there between, transfer loading arm 4 taking out the semiconductor wafer or the cushioning sheet in the carrier case provided adjacent to this mounting base, and a blowing mechanism 6(8) arranged in the vicinity of the semiconductor wafers or the cushioning sheets so as to blow gas from the blowing mechanism when the transfer loading arm sucks the semiconductor wafer or the cushioning sheet in the carrier case.
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Inventors:
Hiroshi Saito
Koji Okamoto
Kenji Kobayashi
Koji Okamoto
Kenji Kobayashi
Application Number:
JP24737697A
Publication Date:
March 28, 2007
Filing Date:
September 12, 1997
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
B65G59/04; B65H3/08; B65H3/48; (IPC1-7): B65G59/04; B65H3/08; B65H3/48
Domestic Patent References:
| JP6255772A | ||||
| JP9086664A | ||||
| JP8231046A | ||||
| JP9008095A | ||||
| JP9064152A | ||||
| JP64022745A |
Attorney, Agent or Firm:
Isono Dozo