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Title:
THERMOPLASTIC MOLDING COMPOSITION AND PREPARATION THEREOF
Document Type and Number:
Japanese Patent JP3195059
Kind Code:
B2
Abstract:

PURPOSE: To provide a thermoplastic polyamide molding composition which can be molded into an article having possessing very good solvent resistance and stress cracking/corrosion resistance and high rigidity at least 100°C.
CONSTITUTION: This thermoplastic molding composition comprises: a) 25 to 75 pts.wt. semicrystalline homopolyamide comprising a 6-13 C ω-aminocarboxylic acid or lactam and a 6-12 C linear dicarboxylic acid; b) (i) 25 to 45 pts.mol. at least one mononuclear or polynuclear arom. dicarboxylic acid or mixture of such dicarboxylic acids, (ii) 25 to 5 pts.mol. dimerized fatty acid comprising a 36-45 C long-chain fatty acid, and (iii) 50 pts.mol. at least one alicyclic diamine having one or more 6 C ring or 75 to 25 pts.wt. amorphous copolyamide comprising a mixture of such diamines, provided that the total of the acids (i) and (ii) and the amine (iii) are present in an equimolar amt.; and c) not less than 30 pts.wt. compatible assistant.


Inventors:
Schmid, Eduard
Thullen, Helmut
Application Number:
JP19905192A
Publication Date:
August 06, 2001
Filing Date:
July 03, 1992
Export Citation:
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Assignee:
EMS INVENTA AG
International Classes:
C08L77/00; C08L77/08; (IPC1-7): C08L77/00; C08L77/08
Attorney, Agent or Firm:
矢野 敏雄 (外2名)



 
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