Title:
THERMOPLASTIC MOLDING MATERIAL BASED ON POLYAMIDE AND STYRENE POLYMER
Document Type and Number:
Japanese Patent JPS62185725
Kind Code:
A
Abstract:
Thermoplastic moulding compositions containing A) 2 - 98% by weight of a modified polyamide prepared from A1) at least 50% by weight of a polyamide and A2) at least 0.1% by weight of a polymer essentially comprising ethylene and polymerisable carboxylic acids and/or functional derivatives thereof, and B) 2 - 98% by weight of a styrene copolymer, and containing carboxylic acid groups and/or groups of functional carboxylic acids are distinguished by very good mechanical properties, in particular high impact strength.
Inventors:
KURISUTOFU TAUBITSUTSU
EERUHARUTO ZAIRAA
YURUGEN HAMUPUREHITO
EERUHARUTO ZAIRAA
YURUGEN HAMUPUREHITO
Application Number:
JP2652287A
Publication Date:
August 14, 1987
Filing Date:
February 09, 1987
Export Citation:
Assignee:
BASF AG
International Classes:
C08L23/08; C08L25/02; C08L25/08; C08L25/16; C08L25/18; C08L33/00; C08L33/02; C08L35/00; C08L73/00; C08L77/00; (IPC1-7): C08L25/08; C08L33/02; C08L77/00
Attorney, Agent or Firm:
Tajiro Taiji