THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCT

Title:

THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCT

Document Type and Number:

Japanese Patent JP2001131404

Kind Code:

A

Abstract:

To provide a chemical-resistant liquid comprising a polyamide, a layered silicate and a liquid crystal resin, a thermoplastic resin composition having an improved gas permeation resistance, chemical resistance and low- temperature toughness wherein the thickness non-uniformity in processing is inhibited, and a molded product.

A thermoplastic resin composition comprises (a) a polyamide resin, (b) a layered silicate and (c) a liquid crystal resin, wherein the amount of (c) the liquid crystal resin is from 0.5 to 100 pts.wt. against 100 pts.wt. total of (a) the polyamide resin and (b) the layered silicate.

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Inventors:

UMETSU HIDEYUKI
NISHIMURA TORU
TATEYAMA MASARU

Application Number:

JP31172499A

Publication Date:

May 15, 2001

Filing Date:

November 01, 1999

Export Citation:

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Assignee:

TORAY INDUSTRIES

International Classes:

C08J5/18; B29D22/00; C08K3/00; C08K3/34; C08K9/04; C08L67/00; C08L77/00; C08L77/12; B29K67/00; B29K77/00; (IPC1-7): C08L77/00; C08J5/18; C08K3/00; C08K9/04; C08L67/00; C08L77/12

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