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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPH0873539
Kind Code:
A
Abstract:

PURPOSE: To obtain a thermoplastic resin composition excellent in heat resistance, rigidity, moistureproofness, coatability, surface properties, etc., without impairing a balance among them and also excellent in weld strength and moldability by mixing a specified modified propylene polymer with a specified polyamide resin.

CONSTITUTION: This composition comprises desirably 5-95wt.% propylene polymer modified with a vinyl monomer having a polar functional group, desirably epoxy or carboxyl group (e.g. PP modified with glycidyl methacrylate) and desirably 95-5wt.% polyamide resin (e.g. nylon 6) in which the amount of the terminal amino groups is larger than that of the terminal carboxyl groups, and desirably the molar ratio of the terminal amino groups to the terminal carboxyl groups is 1.1 or above.


Inventors:
KINOSHITA MASASHI
SHIBATA OU
NIWA TOSHIO
Application Number:
JP21391094A
Publication Date:
March 19, 1996
Filing Date:
September 07, 1994
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C08L23/26; C08F255/02; C08F290/00; C08F290/04; C08G59/34; C08L51/06; C08L63/00; C08L77/00; (IPC1-7): C08F255/02; C08F290/04; C08G59/34; C08L23/26; C08L51/06; C08L63/00; C08L77/00
Attorney, Agent or Firm:
高橋 勝利