Title:
THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2016041827
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection which can form a cured product capable of sufficiently reducing light leakage in a substrate for mounting optical semiconductor element, and to provide the substrate for mounting optical semiconductor element using the thermosetting resin composition for light reflection, a method of manufacturing the same, and an optical semiconductor device.SOLUTION: The thermosetting resin composition for light reflection contains: a thermosetting resin containing an epoxy resin; and an inorganic oxide having a refractive index of 1.6-3.0. The blending amount of the inorganic oxide is 70-400 pts.mass based on 100 pts.mass of the thermosetting resin.SELECTED DRAWING: None
Inventors:
KOTANI HAYATO
URASAKI NAOYUKI
URASAKI NAOYUKI
Application Number:
JP2016000101A
Publication Date:
March 31, 2016
Filing Date:
January 04, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L63/00; C08G59/20; C08K3/22; C08K7/22
Domestic Patent References:
| JP2008189827A | 2008-08-21 | |||
| JP2010031269A | 2010-02-12 | |||
| JP5831424B2 | 2015-12-09 | |||
| JP2008189833A | 2008-08-21 | |||
| JP2008208179A | 2008-09-11 | |||
| JP2004346288A | 2004-12-09 | |||
| JP2008255327A | 2008-10-23 | |||
| JP2010138347A | 2010-06-24 |
Foreign References:
| WO2008111504A1 | 2008-09-18 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Mt. Nakatsuka
Yoshinori Shimizu
Hiroyuki Hirano
Mt. Nakatsuka